Work

Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package

Year: 2019

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2019.2935477

Authors: Mengkai Shih, Chih-Yi Huang, Tsan-Hsien Chen, Chen-Chao Wang, David Tarng, C. P. Hung

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2969828461

FWCI: 1.535

Cites: 22

Cited by: 36

Related to: 10