Work

Base Plate Shape Optimisation for High-Power IGBT Modules

Year: 2008

Type: article

Authors: J.-P. Sommer, Reinhold Bayerer, Roman Tschirbs, Bernd Michel

Institutions: Fraunhofer Institute for Reliability and Microintegration, Infineon Technologies (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W298024045

FWCI: 0.292

Cites:

Cited by: 6

Related to: 10