Year: 2015
Type: article
Abstract: A 3-DoF micro-electromechanical (MEMS) stage has been designed with an innovative integrated feedback system based on thermal sensors. The stage is integrated in the device layer of a silicon-oninsulator-wafer, which means that no assembly is required and the stage can be fabricated using only a single mask. The range of motion is over 160 μm in two directions and 325 mrad of rotation, which exceeds the range of motion of existing MEMS stages by far.
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W2986239603