Work

The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Year: 2019

Type: article

Source: Journal of Manufacturing Processes

DOI: 10.1016/j.jmapro.2019.10.029

Authors: Joanisa P. Curtulo, Marcelino Dias, Felipe Bertelli, Bismarck L. Silva, José E. Spinelli, Amauri Garcia, Noé Cheung

Institutions: Universidade Estadual de Campinas (UNICAMP), Universidade Santa Cecília, Universidade Federal do Rio Grande do Norte, Universidade Federal de São Carlos

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

Funder: Fundação de Amparo à Pesquisa do Estado de São Paulo

Awards: G6476424320, Characterization of microstructure and properties in the evaluation of alloys for thermal interface contact

OpenAlex ID: W2986240997

FWCI: 0.994

Cites: 42

Cited by: 16

Related to: 10