Work

Recent Breakthroughs in Tight Pitch Laser Microdrilling for Mems Guide Plates

Year: 2019

Type: conference-paper

Source: International Wafer Level Packaging Conference (IWLPC)

DOI: 10.23919/iwlpc.2019.8913883

Authors: A. Ferguson, M. Gaukroger, D. Karnakis, M. Cullimore, R. Geremia, S. Tuohy, E. Pelletier, N. Braz, G. Harris, A. Kearsley, M. Knowles

Institution: Oxford Lasers (United Kingdom)

Language: English

Topic: Laser Material Processing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2990897409

FWCI:

Cites:

Cited by: 1

Related to: 10