Work

Design of Additively Manufactured Heatsinks for Power Electronics Thermal Management using Adjoint Level-set Topology Optimization

Year: 2019

Type: conference-paper

Source: International Workshop on Thermal Investigations of ICs and Systems

DOI: 10.1109/therminic.2019.8923530

Authors: Pushpa Rajaguru, Manisekaran Santhanakrishnan, Tim Tilford, Chris Bailey

Institutions: University of Greenwich, Cranfield University

Language: English

Topic: Topology Optimization in Engineering

Subfield: Civil and Structural Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2992033773

FWCI: 3.215

Cites: 9

Cited by: 5

Related to: 10