Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
Year: 2019
Type: article
Authors: Yun Liu, Weiyuan Yu, Xuemin Sun, Fengfeng Wang
Institution: Lanzhou University of Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2993380098