Work

Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

Year: 2019

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2019-6471

Authors: Abdullah Fahim, S. M. Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall

Institution: Auburn University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2995101471

FWCI: 3.96

Cites: 18

Cited by: 12

Related to: 10