Work

Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study

Year: 2019

Type: conference-paper

Source: IMAPSource Proceedings

DOI: 10.4071/2380-4505-2019.1.000492

Authors: T. Bernhard, L. Gregoriades, S. Branagan, L. Stamp, E. Steinhäuser, R. Schulz, F. Brüning

Institution: Atotech (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2995993153

FWCI: 2.772

Cites: 10

Cited by: 12

Related to: 10