Work

Design and solderability characterization of novel Au–30Ga solder for high-temperature packaging

Year: 2020

Type: article

Source: Journal of Materials Science Materials in Electronics

DOI: 10.1007/s10854-019-02787-8

Authors: Han Liu, Songbai Xue, Yu Tao, Weimin Long, Sujuan Zhong

Institutions: Nanjing University of Aeronautics and Astronautics, State Key Laboratory of Advanced Brazing Filler Metals and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: 空间辐射环境对电子器件焊点损伤机制及可靠性研究

OpenAlex ID: W2997731983

FWCI: 1.032

Cites: 25

Cited by: 20

Related to: 10