Work

Ultra-thin Capacitors in Silicon for 3D-Integration and Flexible Electronics

Year: 2019

Type: conference-paper

Source: European Microelectronics and Packaging Conference

DOI: 10.23919/empc44848.2019.8951886

Authors: Mamta Pradhan, Saleh Ferwana, Christine Harendt, Harald Richter, Joachim N. Burghartz

Institutions: University of Stuttgart, Institut für Mikroelektronik Stuttgart

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2998917482

FWCI:

Cites: 11

Cited by: 1

Related to: 10