Work

Effects of an interfacial layer on stress relaxation mechanisms active in the Cu-Si thin film system during thermal cycling

Year: 2020

Type: article

Source: MRS Communications

DOI: 10.1557/mrc.2020.6

Authors: Nalla Somaiah, Anwesha Kanjilal, Praveen Kumar

Institution: Indian Institute of Science Bangalore

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3000415779

FWCI: 0.329

Cites: 24

Cited by: 8

Related to: 10