Work

Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment

Year: 2019

Type: conference-paper

Source: European Microelectronics and Packaging Conference

DOI: 10.23919/empc44848.2019.8951816

Authors: Karsten Schischke, Dionysios Manessis, Jakub Pawlikowski, Tobias Kupka, Thomas Krivec, Rainer Pamminger, Sebastian Glaser, Gerhard Podhradsky, Nils F. Nissen, Martin Schneider-Ramelow, Klaus-Dieter Lang

Institutions: Fraunhofer Institute for Reliability and Microintegration, TU Wien

Language: English

Topic: Environmental Impact and Sustainability

Subfield: Environmental Engineering

Field: Environmental Science

Domain: Physical Sciences

SDGs: Responsible consumption and production, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W3000443608

FWCI: 3.116

Cites: 7

Cited by: 10

Related to: 10