Work

Thermal Conductivity, Electrical Resistivity, and Microstructure of Cu/W Multilayered Nanofilms

Year: 2020

Type: article

Source: ACS Applied Materials & Interfaces

DOI: 10.1021/acsami.9b21182

Authors: Lan Dong, Guo Wei, Tao Cheng, Jun Tang, Xiaobin Ye, Mengqing Hong, Lulu Hu, Ran Yin, Shuqin Zhao, Guangxu Cai, Yin Shi, Bicai Pan, Changzhong Jiang, Feng Ren

Institutions: Wuhan University, University of Science and Technology of China

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, National Outstanding Youth Science Fund Project of National Natural Science Foundation of China, Program for New Century Excellent Talents in University

Awards: Cu-M（M=Au，Ag，Al）双金属合金纳米材料的制备科学及其SERS性能和增强机理研究, G6192198137, 新型部件级纳米多层结构复合阻氚涂层制备和性能研究, 基于缺陷捕获和气体释放的新型抗辐照含纳米孔道材料的制备与性能研究, G95023869

OpenAlex ID: W3001362381

FWCI: 1.961

Cites: 53

Cited by: 37

Related to: 10