Work

Backside and Topside OBIRCH Defect Localization on Multi-layer Finger Structure MOSFET Capacitor with the aid of Focused Ion Beam (FIB)

Year: 2019

Type: conference-paper

Source: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

DOI: 10.1109/ipfa47161.2019.8984843

Authors: Ronald C. Apolinaria, Febus Reidj G. Cruz, Flordeliza L. Valiente

Institution: Mapúa University

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3004456476

FWCI: 0.396

Cites: 7

Cited by: 2

Related to: 10