Work

Intermetallic formation mechanisms and properties in room-temperature Ga soldering

Year: 2020

Type: article

Source: Journal of Alloys and Compounds

DOI: 10.1016/j.jallcom.2020.154221

Authors: Shiqian Liu, Dongdong Qu, Stuart McDonald, Qinfen Gu, Syo Matsumura, Kazuhiro Nogita

Institutions: The University of Queensland, Australian Nuclear Science and Technology Organisation, Australian Synchrotron, Kyushu University, The Ultramicroscopy Research Center, Kyushu University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Australian Synchrotron, Ministry of Education, Culture, Sports, Science and Technology, University of Queensland, Kyushu University, China Scholarship Council, Nihon Superior

Award: G6559153553

OpenAlex ID: W3005430833

FWCI: 1.546

Cites: 37

Cited by: 33

Related to: 10