Work

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Year: 2020

Type: article

Abstract: With the development of electronical technology and the construction of the fifth‐generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High‐Pb solder alloys were widely used for low‐ and medium‐temperature soldering for the past decades but have been prohibited due to toxicity. Au‐based solder alloys with proper melting and mechanical properties show great potential to replace high‐Pb solder alloys and are being emphasized recently. But in comparison with Pb‐containing solder alloys, the investigation on novel Au‐based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au‐based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au‐based solder alloys were discussed and compared.

Source: Advances in Materials Science and Engineering

DOI: 10.1155/2020/4969647

Authors: Jiachen Xu, Mingfang Wu, Juan Pu, Songbai Xue

Institutions: Jiangsu University of Science and Technology, Nanjing University of Aeronautics and Astronautics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $2,670

Funders: Jiangsu Province Postdoctoral Science Foundation, Government of Jiangsu Province