Work

Deep reactive ion etching of silicon using non-ICP-based equipment

Year: 2020

Type: article

Source: Applied Physics A

DOI: 10.1007/s00339-020-03732-x

Authors: Zaifa Du, Junyang Nie, Dianlun Li, Weiling Guo, Qun Yan, Le Wang, Tailiang Guo, Jie Sun

Institutions: Beijing University of Technology, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou University, Xi'an Jiaotong University

Language: English

Topic: Low-Pressure Plasma Processing and Diagnostics

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G8286539620

OpenAlex ID: W3036729492

FWCI:

Cites: 27

Cited by: 1

Related to: 10