Work

Autocatalytic tin - how to overcome process limitations to introduce a new solution for thick tin plating

Year: 2020

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc32862.2020.00308

Authors: K. Johal, B. Schafsteller, G. Ramos, K. Tuna, S. Nelle

Institution: Atotech (Germany)

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Surfaces, Coatings and Films

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3047401615

FWCI: 1.186

Cites: 6

Cited by: 3

Related to: 10