Nanotwinned Copper Hybrid Bonding and Wafer-On-Wafer Integration
Year: 2020
Type: conference-paper
Authors: Wei-Lan Chiu, Kai-Wei Chou, Hsiang-Hung Chang
Institution: Industrial Technology Research Institute
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W3048281908