Work

A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging

Year: 2020

Type: article

Source: International Journal of Polymer Analysis and Characterization

DOI: 10.1080/1023666x.2020.1807680

Authors: Fabian Huber, Harald Etschmaier, Hans Walter, Georg Urstöger, Peter Hadley

Institutions: AMS (Austria), Graz University of Technology, Fraunhofer Institute for Reliability and Microintegration

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3081381982

FWCI: 0.775

Cites: 39

Cited by: 11

Related to: 10