Work

A New Concept of Multichip Modules (Customers Designed Copper/polyimide Thin Film Interconnection on Standardized Cofired AN Substrates)

Year: 1993

Type: article

Authors: M. Nii, Minoru Hirai, Takashi Koyanagawa, H. HIRAI, O. Shimada, S. Kimishima, Yoshitaka Fukuoka, Yoshihisa Shiotari, M. Hitosugi

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3082372095

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