Elastothermodynamic damping modeling of three-layer Kirchhoff–Love microplate considering three-dimensional heat conduction
Work
Year: 2020
Type: article
Source: Applied Mathematical Modelling
Cites: 30
Cited by: 20
Related to: 10
FWCI: 1.824
Citation percentile (by year/subfield): 82.85
Subfield: Mechanics of Materials
Field: Engineering
Domain: Physical Sciences
Sustainable Development Goal Affordable and clean energy
Open Access status: closed