Work

Laser Soldering of Sn-based Solders with Different Melting Points

Year: 2020

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept50128.2020.9202414

Authors: Hua Chen, Jianlin Liang, Renxi Gao, Yujie Li

Institutions: Harbin Institute of Technology, State Key Laboratory of Advanced Welding and Joining

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3089258786

FWCI: 3.506

Cites: 11

Cited by: 11

Related to: 10