Work

Leakage-Aware Dynamic Thermal Management of 3D Memories

Year: 2020

Type: article

Source: ACM Transactions on Design Automation of Electronic Systems

DOI: 10.1145/3419468

Authors: Lokesh Siddhu, Rajesh Kedia, Preeti Ranjan Panda

Institution: Indian Institute of Technology Delhi

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Ministry of Electronics and Information technology

Award: G2251862756

OpenAlex ID: W3093483245

FWCI: 0.601

Cites: 38

Cited by: 10

Related to: 10