Work

Insights into the atomic scale structure, bond characteristics and wetting behavior of Cu(001)/Cu6Sn5(110) interface: A first-principles investigation

Year: 2021

Type: article

Source: Vacuum

DOI: 10.1016/j.vacuum.2021.110103

Authors: Wenchao Yang, Jingwu Wu, Mingjun Pang, Yongzhong Zhan

Institutions: Guangxi University, South China University of Technology, SAIC-GM-Wuling (China)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Guangxi Province

OpenAlex ID: W3126887005

FWCI: 1.322

Cites: 40

Cited by: 25

Related to: 10