Work

Optimal Cu paste thickness for large-area Cu-Cu joint

Year: 2021

Type: article

Source: Materials Letters

DOI: 10.1016/j.matlet.2021.129533

Authors: Lingmei Wu, Jing Qian, Jiabing Yu, Haojie Guo, Xianping Chen

Institution: Chongqing University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: 基于高通量的Janus型二维气敏材料设计与性能调控研究

OpenAlex ID: W3131152227

FWCI: 0.441

Cites: 12

Cited by: 8

Related to: 10