Imaging-based overlay metrology optimized by HV-SEM in 3D-NAND process
Year: 2021
Type: conference-paper
DOI: 10.1117/12.2583609
Institution: Macronix International (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W3131609342
