Work

The influence of the PCB design and the process of their manufacturing on the possibility of a defect-free production

Year: 2021

Type: article

Source: PRZEGLĄD ELEKTROTECHNICZNY

DOI: 10.15199/48.2021.03.18

Author: Fedor VASILYEV

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W3135810367

FWCI: 1.616

Cites:

Cited by: 28

Related to: 10