Work

LPCVD Tungsten Filled vias for Multilayer Metallization

Year: 1987

Type: conference-paper

Source: European Solid-State Device Research Conference

Authors: Zhang, Buchta, Johansson, Norstrom, Wennstrom

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3145328504

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