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Eco-friendly Soldering Technique

Year: 2021

Type: book-chapter

Source: Springer eBooks

DOI: 10.1007/978-3-030-69925-3_73

Authors: Puskaraj D. Sonawwanay, V. K. Bupesh Raja

Institutions: MIT World Peace University, Sathyabama Institute of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W3176722158

FWCI: 3.083

Cites: 7

Cited by: 4

Related to: 10