Work

The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach

Year: 2021

Type: article

Source: Materials Today Communications

DOI: 10.1016/j.mtcomm.2021.102772

Authors: Yong-Jae Kim, Byung-Ho Park, Soong-Keun Hyun, Hiroshi Nishikawa

Institutions: Inha University, Joining and Welding Research Institute, The University of Osaka

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Ministry of Trade, Industry and Energy, Korea Institute for Advancement of Technology

Award: G8027163069

OpenAlex ID: W3200765626

FWCI: 2.13

Cites: 43

Cited by: 52

Related to: 10