Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging
Year: 2021
Type: article
Source: Microelectronics Reliability
Authors: Pierre Roumanille, Emna Ben Romdhane, Samuel Pin, Patrick Nguyen, Jean-Yves Delétage, Alexandrine Guédon-Gracia, Hélène Frémont
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Agence Nationale de la Recherche
Award: SAINT EXUPERY
OpenAlex ID: W3205154045