Work

Structural optimization of reducing the thermal stress and Smile in packaging a high-power diode laser array on a microchannel cooler using gold-tin hard solder

Year: 2021

Type: conference-paper

Source: Semiconductor Lasers and Applications

DOI: 10.1117/12.2602338

Authors: Jingwei Wang, Tuanwei Fu, Dong Hou, Lijun Gao, Chung-en Zah, Xingsheng Liu

Institution: University of Chinese Academy of Sciences

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3207216005

FWCI: 0.771

Cites:

Cited by: 2

Related to: 10