Work

Modeling and Simulation of Interconnection Structure Compensation Design in High-speed Modules

Year: 2021

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

DOI: 10.1109/icept52650.2021.9567999

Authors: Qi Zheng, Huimin He, Lijuan Bai, Yubo Wang, Dejian Li, Shunfeng Han, Bofu Li, Dameng Li, Fengman Liu, Liqiang Cao

Institutions: Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Semiconductor Lasers and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W3209195692

FWCI: 0.774

Cites: 7

Cited by: 3

Related to: 10