Work

Impact of Sub-µm Wafer Thinning on Latch-up Risk in STCO Scaling Era

Year: 2021

Type: conference-paper

Source: Annual EOS/ESD Symposium (EOS/ESD)

DOI: 10.23919/eos/esd52038.2021.9574787

Authors: Kateryna Serbulova, Shih-Hung Chen, Geert Hellings, Gaspard Hiblot, Anabela Veloso, Anne Jourdain, Jo De Boeck, Guido Groeseneken, Naoto Horiguchi

Institutions: IMEC, KU Leuven

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3209841780

FWCI: 1.927

Cites: 8

Cited by: 5

Related to: 10