Work

Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability

Year: 2021

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2021.114443

Authors: Donghua Li, Defu Sun, Xiumei Bi, Guiqing Liu, Yingxin Zhang, Yuqi Cui, Yingxin Song, Zongtao Chi, Zhongsen Sun, Chuanzhong Chen

Institutions: Shandong University, Qingdao University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Key Research and Development Projects of Shaanxi Province

Award: G2115512816

OpenAlex ID: W3215112486

FWCI: 0.294

Cites: 29

Cited by: 8

Related to: 10