Work

221 Development of Chemo-Mechanical Grinding (CMG) Process

Year: 2003

Type: conference-paper

Abstract: To achieve a perfectly damage-free surface by fixed abrasive, this research has proposed a new chemo-mechanical-grinding (CMG) process by effective using chemical reaction at the grinding process. First described in this paper are the experimental results showing the feasibilities of the CMG process in reducing subsurface damage, followed by development and characterization of CMG wheel with a wide range of pH from acidity to alkalinity. The CMG process has been applied mainly into φ300mm bare Si wafers, and its performance has been evaluated by comparing to grinding with diamond wheels.

Source: Proceedings of International Conference on Leading Edge Manufacturing in 21st century LEM21

DOI: 10.1299/jsmelem.2003.315

Authors: L. Zhou, S. Kawaii, S. Kimura, J. Shimizu, H. EDA

Institution: Ibaraki University

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: diamond

OpenAlex ID: W326205452

FWCI: 2.518

Cites: 2

Cited by: 9

Related to: 10