Work

Mechanical properties and fatigue lifetime prediction of solders for electronic applications : tin-silver and tin-zinc eutectics

Year: 1996

Type: book

Source: University Microfilms International eBooks

Author: H. Mavoori

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W399189372

FWCI:

Cites:

Cited by: 7

Related to: 10