Work

Silver sintering technology based on induction heating for chip level bonding

Year: 2021

Type: conference-paper

Source: IEEE CPMT Symposium Japan (ICSJ)

DOI: 10.1109/icsj52620.2021.9648867

Authors: Christian Hofmann, Mario Baum, Maulik Satwara, Martin Kroll, Sushant Panhale, Patrick Rochala, Soumya-Deep Paul, Kiyoshi Oi, Kei Murayama, Maik Wiemer, Harald Kuhn

Institutions: Fraunhofer Institute for Electronic Nano Systems, Chemnitz University of Technology, Shinko Electric Industries (Japan), Shinko Electric Co., Ltd. (Japan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4200300075

FWCI: 1.542

Cites: 5

Cited by: 5

Related to: 10