Work

Single crystal silicon wafer polishing by pretreating pad adsorbing SiO2 grains and abrasive-free slurries

Year: 2021

Type: article

Source: Materials Science in Semiconductor Processing

DOI: 10.1016/j.mssp.2021.106418

Authors: Zhengzheng Bu, Fengli Niu, Jiapeng Chen, Zhenlin Jiang, Wenjun Wang, Xuehan Wang, Hanqiang Wang, Zefang Zhang, Yongwei Zhu, Tao Sun

Institutions: Shanghai University of Engineering Science, Nanjing University of Aeronautics and Astronautics

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Science and Technology Program of Zhejiang Province

Awards: G1813306006, G7842945337

OpenAlex ID: W4200548016

FWCI: 1.204

Cites: 22

Cited by: 26

Related to: 10