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A 1596GB/s 48Gb Embedded DRAM 384-Core SoC with Hybrid Bonding Integration

Year: 2021

Type: conference-paper

Source: IEEE Asian Solid-State Circuits Conference (A-SSCC)

DOI: 10.1109/a-sscc53895.2021.9634704

Authors: Xiping Jiang, Fengguo Zuo, Song Wang, Xiaofeng Zhou, Bing Yu, Yubing Wang, Qi Liu, Ming Liu, Yi Kang, Qiwei Ren

Institutions: Chinese Academy of Sciences, Institute of Microelectronics, Xi'an UniIC Semiconductors (China), University of Chinese Academy of Sciences, University of Science and Technology of China

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4200550987

FWCI: 2.698

Cites: 8

Cited by: 9

Related to: 10