Work

Mechanical Suite of Flexural Bending Method for Electronic Memory Packages

Year: 2021

Type: conference-paper

Source: IEEE International Conference on Sensors and Nanotechnology (SENNANO)

DOI: 10.1109/sennano51750.2021.9642645

Authors: Vance Liu, Shams Arifeen, Cassie Bassett, Min Chung, CL Gan, Hem Takiar

Institutions: Micron (Taiwan), Micron (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Micron Technology

OpenAlex ID: W4200575896

FWCI: 3.482

Cites: 4

Cited by: 12

Related to: 10