Work

Damage layer in silica-based low-k material induced by the patterning plasma process studied by energy-filtered TEM

Year: 2006

Type: book-chapter

Source: Springer eBooks

DOI: 10.1007/3-540-31915-8_74

Authors: O Richard, F Iacopi, Zs Tőkei, H Bender

Institution: IMEC

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W42081971

FWCI: 1.733

Cites: 2

Cited by: 1

Related to: 10