ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs
Year: 2022
Type: conference-paper
Authors: Akhilesh Kumar, Norman Chang, David Geb, Haiyang He, Stephen Pan, Jimin Wen, Saeed Asgari, Mehdi Abarham, Chris Ortiz
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4229451260