Work

Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications

Year: 2010

Type: conference-abstract

Source: ECS Meeting Abstracts

DOI: 10.1149/ma2010-02/27/1690

Authors: Viorel Dragoi, Gerald Mittendorfer, Jürgen Burggraf, Erkan Cakmak, Markus Wimplinger

Institution: EV Group (Austria)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: bronze

OpenAlex ID: W4232159363

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