Work

Direct chip interconnect using polymer bonding

Year: 1990

Type: article

Source: IEEE Transactions on Components Hybrids and Manufacturing Technology

DOI: 10.1109/33.52876

Author: K. Gilleo

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4237616280

FWCI: 1.872

Cites: 4

Cited by: 11

Related to: 10