High Performance Computing Package With Chip Module on Substrate Solutions
Year: 2021
Type: other
DOI: 10.1115/1.0003557v
Authors: Ching Chia Chen, Vito Lin, Joe Liang, David Lai, Yu-Po Wang
Language: English
Subfield: Computer Networks and Communications
Field: Computer Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4239256342