Work

Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability

Year: 2013

Type: article

Source: Journal of Microelectronics and Electronic Packaging

DOI: 10.4071/imaps.373

Authors: Satoshi Tanimoto, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami, Masato Takamori, Takashi Iseki

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4240731369

FWCI: 0.393

Cites:

Cited by: 3

Related to: 10