Work

Encapsulating Plastic Microelectronics

Year: 2019

Type: reference-entry

Source: WORLD SCIENTIFIC eBooks

DOI: 10.1142/9789811209666_0007

Author: ERIC KUAH

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4254869998

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